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UV-nanoimprint lithography (UV-NIL) footfall and echo system, EVG770 Gen II NIL Stepper, incorporates abilities that advance action reliability, accuracy, and arrangement allegiance at abbreviating affection densities. While exhaustion imprinting on spun-on polymer band eliminates birthmark issues acquired by trapped air bubbles, optical sensors adjust brand and dent into absolute accompaniment for contact-free block compensation. Chuck movement, via non-contact abode system, reduces atom contamination.
NIL Stepper Offers Added Arrangement Fidelity, Bigger Crop at Lower Accomplishment Costs
ST. FLORIAN, Austria, July 13 — EV Group (EVG), a arch supplier of dent bonding and lithography accessories for the MEMS, nanotechnology and semiconductor markets, today apparent its next-generation UV-nanoimprint lithography (UV-NIL) footfall and echo system–the EVG770 Gen II NIL Stepper. The new arrangement appearance capabilities advised to abode growing chump demands for bigger arrangement allegiance at ever-smaller affection densities, greater action believability and added accuracy.
Commenting on today’s announcement, EVG’s Executive Technology Director, Paul Lindner, noted, “We accept been alive in the nanoimprint lithography bazaar for added than a decade now, and accept apparent the technology advance from its canicule in R&D to accomplishment reality. To be allotment of enabling next-generation lithography–and acclamation our customers’ needs–is absolutely agitative for the aggregation in countless ways.” Added Lindner, “The accession of the EVG770 reinforces the company’s charge to our amateur ‘i’ aesthetics of invent, innovate and implement–providing our barter with a awful adjustable band-aid to accommodated their R&D and assembly requirements. We attending avant-garde to connected opportunities to assignment carefully with our barter for their NIL needs.”
Nanoimprint lithography has risen to become a aggressive applicant for next-generation lithography (NGL) due to its aerial resolution and cost-effective advantages. The technology’s abeyant has been accustomed by arch experts, and has been added to the International Technology Roadmap for Semiconductors (ITRS) as a -to-be NGL apparatus for micro- and nanoelectronics at the 32-nm bulge and beyond.
One of the capital markets alive UV-NIL acceptance is the micro-optics arena, which utilizes adept lenses to advance alive stamps for full-wafer lens micro-molding of CMOS angel sensors for wafer-level cameras, amid others. Augmenting acceptable single-step processes, EVG’s footfall and echo access enables manufacturers to actualize a adept that can again be replicated beyond the substrate to after aftermath a full-wafer lens micro-mold. This access offers cogent crop and amount advantages compared to accepted arrive processes, such as micromachining techniques (e.g., design drilling), photoresist reflow, LIGA and e-beam writing.
In accession to CMOS angel sensors, there is cogent bazaar abeyant for EVG’s NIL stepper in added micro-electronics applications, including micro-lens arrays, waveguides, arena resonators, as able-bodied as R&D nanoelectronics processes for bifold damascene and acquaintance holes.
EVG770 Key Appearance & Benefits
Some of the key new appearance the EVG770 touts accommodate exhaustion imprinting on a spun-on polymer layer, which eliminates birthmark issues acquired by trapped air bubbles–ultimately consistent in above arrangement fidelity. With these new capabilities, the EVG NIL stepper tackles issues faced by added UV-NIL approaches in which vacuum-less environments and resists are dispensed as aerosol rather than pre-spun, which account accessible air accessories and appulse structural integrity.
Additionally, EVG’s next-generation arrangement features:– Optical sensors that adjust the brand and dent into absolute accompaniment for contact-free block compensation– Chuck movement via a non-contact abode arrangement to abate atom contamination– High-precision alignment arrangement with accurateness aural /-500 nm; — Load-cell altitude of embossing/de-embossing force, convalescent banner accord and action believability due to alive force ascendancy and acceptance for real-time, in-situ assuming of assorted commercially accessible resists and anti-sticking layers– Adjustable accessories automation levels, authoritative the NIL Stepper, an accessible and economical alteration from R&D to small- or high-volume manufacturing– De facto arrangement anatomy agency to abbreviate the artifact turnaround time– Capability to abutment a host of commercially accessible resists with capricious viscosities amid 1 to several 1,000 mPas, convalescent action adaptability for micro abstraction and nanopatterning
EVG has been alive in UV-NIL back 1997, and has back formed with assorted industry ally and R&D institutions to advance nanoimprinting technologies. Recent UV-NIL activities accommodate an adjustment from Fraunhofer IOF appear in May 2009.
The EVG770 is accessible anon for purchase. For added advice or to apprentice added about the EVG770 and added EVG NIL solutions, amuse appointment www.evgroup.com.
About EV Group
EV Group (EVG) is a apple baton in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through abutting accord with its all-around customers, the aggregation accouterments its adjustable accomplishment archetypal to advance reliable, high-quality, low-cost-of-ownership systems that are calmly chip into customers’ fab lines. Key articles accommodate dent bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as able-bodied as photoresist coaters, cleaners and analysis systems.
In accession to its ascendant allotment of the bazaar for dent bonders, EVG holds a arch position in NIL and lithography for avant-garde packaging and MEMS. Along these lines, the aggregation co-founded the EMC-3D bunch in 2006 to actualize and advice drive accomplishing of a cost-effective through-silicon via (TSV) action for above ICs and MEMS/sensors. Added ambition semiconductor-related markets accommodate silicon-on-insulator (SOI), admixture semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a all-around chump abutment network, with subsidiaries in Tempe, Ariz.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company’s different Amateur i-approach (invent – innovate – implement) is accurate by a vertical integration, acceptance EVG to acknowledge bound to new technology developments, administer the technology to accomplishment challenges and accelerate accessory accomplishment in aerial volume. Added advice is accessible at www.EVGroup.com
CONTACT: Clemens Schutte, Director, Marketing and Communications of EV Group, 43 7712 5311 0, Marketing@EVGroup.com; or Karen Do, Account Manager of MCA, Inc., 1-650-968-8900, ext. 108, firstname.lastname@example.org, for EV Group
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